EASR3212BA3 features ? package in 8mm tape on 7 diameter reel. ? compatible with automatic placement equipment. ? compatible with infrared and vapor phase reflow solder process. ?mono-color type. ?pb-free. ?the product itself will r ema in within rohs compl iant version. descriptions ?the EASR3212BA3 smd led is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ? besides, lightweight makes them ideal for miniature applications. etc. applications ?backlighting in dashboard and switch. ? telecommunication: indicator and backlighting in telephone and fax. ? flat backlight for lcd, switch and symbol. ?general use. device selection guide chip part no. material emitted color resin color EASR3212BA3 ingan blue water clear page 1 of 10 rev. 0.01
package outline dimensions note: the tolerances unless mentioned is 0.1mm ,unit = mm datasheet EASR3212BA3 page 2 of 10 rev. 0.01
absolute maximum ratings (ta=25 ) parameter symbol rating unit reverse voltage v r 5 v forward current i f 25 ma peak forward current (duty 1/10 @1khz) i fp 100 ma power dissipation pd 95 mw electrostatic discharge(hbm) esd 150 v operating temperature topr -40 ~ +85 storage temperature tstg -40 ~ +90 soldering temperature tsol reflow soldering : 260 for 10sec. hand soldering : 350 for 3 sec. electro-optical characteristics (ta=25 ) parameter symbol min. typ. max. unit condition luminous intensity iv 45.0 ----- 112.0 mcd viewing angle 2 1/2 ----- 130 ----- deg peak wavelength p ----- 468 ----- nm dominant wavelength d 464.5 ----- 476.5 nm spectrum radiation bandwidth ----- 25 ----- nm forward voltage v f 2.7 3.3 3.7 v i f =20ma reverse current i r ----- ----- 50 a v r =5v notes: 1.tolerance of luminous intensity 11% 2.tolerance of dominant wavelength 1nm datasheet EASR3212BA3 page 3 of 10 rev. 0.01
bin range of luminous intensity group bin min max unit condition a9 464.5 467.5 a10 467.5 470.5 a11 470.5 473.5 a a12 473.5 476.5 nm i f =20ma bin range of luminous intensity bin min max unit condition p1 45.0 57.0 p2 57.0 72.0 q1 72.0 90.0 q2 90.0 112.0 mcd i f =20ma notes: 1.tolerance of luminous intensity 11% 2.tolerance of dominant wavelength 1nm datasheet EASR3212BA3 page 4 of 10 rev. 0.01
typical electro-optical characteristics curves datasheet EASR3212BA3 page 5 of 10 rev. 0.01
label explanation cat: luminous intensity rank hue: dom. wavelength rank ref: forward voltage rank reel dimensions note: the tolerances unless mentioned is 0.1mm,unit = mm datasheet EASR3212BA3 page 6 of 10 rev. 0.01
carrier tape dimensions: loaded quantity 2000 pcs per reel note: the tolerances unless mentioned is 0.1mm , unit = mm moisture resistant packaging label desiccant label aluminum moisture-proof bag datasheet EASR3212BA3 page 7 of 10 rev. 0.01
reliability test items and conditions the reliability of products shall be satisfied with items listed below. confidence level 22 pcs. 0/1 2 temperature cycle h : +100 22 pcs. 0/1 3 thermal shock h : +100 22 pcs. 0/1 4 high temperature storage temp. : 100 22 pcs. 0/1 5 low temperature storage temp. : -40 22 pcs. 0/1 6 dc operating life i f = 20ma 1000 hrs. 22 pcs. 0/1 7 high temperature / high humidity 85 22 pcs. 0/1 datasheet EASR3212BA3 page 8 of 10 rev. 0.01
precautions for use 1. over-current-proof customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package, the leds should be kept at 30 or less and 90%rh or less. 2.3 after opening the package: the led's floor life is 1 year under 30 or less and 60% rh or less. if u n u sed leds remain, it should be stored in moisture proof packages. 2.4 if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 60 5 for 24 hours. 3. soldering condition 3.1 pb-free solder temperature profile 3.2 reflow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board. datasheet EASR3212BA3 page 9 of 10 rev. 0.01
4.soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. be careful because the da mage of the product is often started at the time of the hand solder. 5.repairing repair should not be done after the leds have been soldered. when repairing is unavoidable, a double- head soldering iron should be used (as below figure). it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. datasheet EASR3212BA3 page 10 of 10 rev. 0.01
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